description avago power plcc-4 is an extension of our plcc-2 smt leds. the package can be driven at higher current due to its superior package design. the product is able to dissi- pate heat more efficiently compared to the conventional plcc-2 smt leds. in proportion to the increase in driving current, this family of leds is able to produce higher light output compared to the conventional plcc-2 smt leds. these smt leds have higher reliability and better perfor- mance and are designed to work under a wide range of environmental conditions. this higher reliability makes them suitable for use under harsh environment and con- ditions like automotive. in addition, they are also suitable to be used in electronic signs and signals. to facilitate easy pick and place assembly, the leds are packed in eia-compliant tape and reel. every reel will be shipped in single intensity and color bin (except for red color), to provide close uniformity. these leds are compatible with ir solder reflow process. due to the high reliability feature of these products, they also can be mounted using through-the-wave soldering process. there are a variety of colors and various viewing angles (30, 60 and 120) available in these smt leds. ideally, the 30 parts are suitable for light piping where focused inten- sities are required. as for the 60 and 120, they are most suitable for automotive interior and exterior lighting and electronic signs applications. caution: hsmn-, hsmk-, hsmm-a40x-xxxxx leds are class 2 esd sensitive. please observe appropriate precautions during handling and processing. refer to avago application note an-1142 for additional details. hsmx-a4xx-xxxxx smt led surface mount led indicator data sheet features industry standard plcc-4 high reliability led package high brightness using alingap and ingan dice technologies high optical efficiency higher ambient temperature at the same current possible compared to plcc-2 available in full selection of colors super wide viewing angle at 120? available in 8mm carrier tape on 7-inch reel compatible with both ir and ttw soldering process jedec msl 2a high reliability led package due to enhanced silicone resin material for ingan family applications interior automotive C instrument panel backlighting C central console backlighting C cabin backlighting C navigation and audio system C dome lighting C push button backlighting exterior automotive C turn signals C chmsl C rear combination lamp C puddle light electronic signs and signals C interior full color sign C variable message sign office automation, home appliances, industrial equipment C front panel backlighting C push button backlighting C display backlighting
2 package dimensions device selection guide color part number min. i v (mcd) max. i v (mcd) test current (ma) dice technology red hsmc-a400-s30m1 180.00 355.00 50 alingap red orange hsmj-a401-t40m1 285.00 715.00 50 alingap hsmj-a401-u40m1 450.00 1125.00 50 alingap orange hsml-a401-u40m1 450.00 1125.00 50 alingap amber hsma-a401-u45m1 450.00 1125.00 50 alingap emerald green hsme-a401-p4pm1 45.00 112.50 50 alingap blue hsmn-a400-s8qm2 224.00 560.00 30 ingan hsmn-a400-s8pm2 224.00 560.00 30 ingan hsmn-a400-s4qm2 180.00 450.00 30 ingan green hsmm-a400-u4qm2 450.00 1125.00 30 ingan notes: 1. the luminous intensity i v , is measured at the mechanical axis of the lamp package. the actual peak of the spatial radiation pattern may not be aligned with this axis. 2. i v tolerance = 12 %. 0.8 0.3 3.5 0.2 2.8 0.2 0.5 0.1 3.2 0.2 2.2 0.2 1.9 0.2 0.1 typ. 0.8 0.1 cathode marking 0.7 0.1 cc ac notes: all dimensions in mm. electrical connection between all cathodes is recommended.
3 absolute maximum ratings (t a = 25c) parameters hsmc/j/l/a/e hsmz/v/u hsmm/k/n dc forward current [1] 70 ma [3,4] 70 ma [3,4] 30 ma peak forward current [2] 200 ma 200 ma 90 ma power dissipation 180 mw 240 mw 114 mw reverse voltage 5 v junction temperature 110c operating temperature C40c to +100c storage temperature C40c to +100c notes: 1. derate linearly as shown in figure 5. 2. duty factor = 10%, frequency = 1 khz. 3. drive current between 10 ma and 70 ma is recommended for best long-term performance. 4. operation at currents below 5 ma is not recommended. part numbering system hsm x 1 C a x 2 x 3 x 4 C x 5 x 6 x 7 x 8 x 9 packaging option color bin selection intensity bin select device specific configuration package type led chip color
4 optical characteristics (t a = 25c) peak dominant luminous luminous intensity/ wavelength wavelength viewing angle efficacy v [3] total flux part peak (nm) d [1] (nm) 2 1/2 [2] (degrees) (lm/w) i v (mcd)/ v (mlm) color number typ. typ. typ. typ. typ. red hsmc 635 626 120 150 0.45 hsmz 639 630 120 155 0.45 red orange hsmj 621 615 120 240 0.45 hsmv 623 617 120 263 0.45 orange hsml 609 605 120 320 0.45 amber hsma 592 590 120 480 0.45 hsmu 594 592 120 500 0.45 yellow green hsme 576 575 120 560 0.45 emerald green hsme 568 567 120 610 0.45 green hsmm 518 525 120 500 0.45 cyan hsmk 502 505 120 300 0.45 blue hsmn 468 470 120 75 0.45 notes: 1. the dominant wavelength, d , is derived from the cie chromaticity diagram and represents the color of the device. 2. 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 3. radiant intensity, i e in watts/steradian, may be calculated from the equation i e = i v / v , where i v is the luminous intensity in candelas and v is the luminous efficacy in lumens/watt. electrical characteristics (t a = 25c) forward voltage reverse voltage v f (volts) @ i f = 50 ma v r @ 100 a part number typ. max. min. hsmc/j/l/a/e 2.2 2.5 5 hsmz/v/u 2.8 3.4 5 forward voltage reverse voltage v f (volts) @ i f = 30 ma v r @ 10 a part number typ. max. min. hsmm/k/n 3.8 4.6 5 figure 1. relative intensity vs. wavelength wavelength C nm emerald green relative intensity 1.0 0.8 0 380 480 580 680 730 780 630 530 430 blue cyan 0.6 0.4 0.2 green yellow green amber orange red orange red 0.1 0.3 0.5 0.7 0.9
5 figure 2. forward current vs. forward voltage f igure 3. relative intensity vs. forward current (alingap) figure 4. relative intensity vs. forward current (ingan) figure 5a. maximum forward current vs. ambi- ent temperature, derated based on t j max = 110c (alingap) figure 6. dominant wavelength vs. forward current C ingan devices figure 7. radiation pattern 040 forward current C ma 0 0.4 relative intensity (normalized at 50 ma) 80 0.8 0.2 1.0 20 0.6 1.2 60 10 30 70 1.4 50 020 current C ma 460 480 540 dominant wavelength C nm 35 500 470 510 10 490 520 25 ingan green 515 30 530 ingan cyan ingan blue relative intensity 1.0 0 angle C degrees 0.8 0.6 0.2 0.4 -70 -50 -30 30 50 70 90 -90 -10 10 0.1 0.3 0.5 0.7 0.9 0 80 0 20 60 80 120 maximum forward current C ma ambient temperature C c 40 40 60 30 300c/w 20 70 100 10 350c/w 470c/w 50 0 0 20 60 80 120 maximum forward current C ma ambient temperature C c 40 20 30 15 300c/w 10 35 100 5 350c/w 470c/w 25 figure 5b. maximum forward current vs. ambi- ent temperature, derated based on t j max = 110c (ingan) 03 forward voltage C v 0 20 70 80 forward current C ma 10 50 40 60 12 45 hsmm/k/n hsmz/v/u hsmc/j/l/a/e 30 020 forward current C ma 0 0.4 relative luminous intensity (normalized at 30 ma) 35 0.8 0.2 1.0 10 0.6 1.2 30 515 25
6 figure 8a. recommended soldering pad pattern figure 8b. recommended soldering pad pattern (ttw) thermal resistance solder pad area (xy) 300c/w >16 mm 2 350c/w >12 mm 2 470c/w >8 mm 2 x x 0.5 (0.020) y y 1.0 (0.039) 2.0 (0.079) 2.0 (0.079) 6.0 (0.236) 3.0 (0.118) 2.8 (0.110) 6.1 (0.240) dimensions in mm (inches). represents electrical connectivity between pads 2.60 (0.103) solder resist represents electrical connectivity between pads 4.50 (0.178) y x 0.40 (0.016) x 0.50 (0.020) y 1.10 (0.043) 1.50 (0.059) dimensions in mm (inches).
7 figure 9a. recommended snpb reflow soldering profile figure 10. recommended wave soldering profile figure 9b. recommended pb-free reflow soldering profile. note: for detailed information on reflow soldering of avago surface mount leds, refer to avago application note an 1060 surface mounting smt led indicator components . 240c max. 20 sec. max. 3c/sec. max. 120 sec. max. time temperature 183c 100-150c C6c/sec. max. 60-150 sec. 3c/sec. max. 217 c max. 120 sec. 6 c/sec. max. 3 c/sec. max. 125 c 25 c 255 c 60 to 150 sec. 10 to 20 sec. time temperature +5 c -0 c figure 11. recommended pick and place nozzle size for ingan family note: diameter "d" should be smaller than 2.2mm laminar wave bottom side of pc board hot air knife turbulent wave fluxing preheat 01020 30 50 100 150 200 250 30 40 50 time C seconds temperature C c 60 70 80 90 100 top side of pc board conveyor speed = 1.83 m/min (6 ft/min) preheat setting = 150c (100c pcb) solder wave temperature = 245c air knife air temperature = 390c air knife distance = 1.91 mm (0.25 in.) air knife angle = 40 solder: sn63; flux: rma note: allow for boards to be sufficiently cooled before exerting mechanical force. d
8 figure 12. tape leader and trailer dimensions figure 14. reeling orientation figure 13. tape dimensions c a 4 0.1 2 0.05 8 0.1 5.5 0.05 12 +0.3 C0.1 1.75 0.1 3.8 0.1 3.6 0.1 0.229 0.01 ? 1.5 +0.1 C0 ? 1 +0.1 C0 c c 3.45 0.1 a a view a-a view b-b b b all dimensions in mm. 200 mm min. for ?180 reel. 200 mm min. for ?330 reel. trailer component leader 480 mm min. for ?180 reel. 960 mm min. for ?330 reel. c a user feed direction cathode side printed label user feed direction
9 intensity bin select (x 5 x 6 ) individual reel will contain parts from one half bin only. x 5 min. iv bin x 6 0 full distribution 2 2 half bins starting from x 5 1 3 3 half bins starting from x 5 1 4 4 half bins starting from x 5 1 5 5 half bins starting from x 5 1 6 2 half bins starting from x 5 2 7 3 half bins starting from x 5 2 8 4 half bins starting from x 5 2 9 5 half bins starting from x 5 2 intensity bin limits bin id min. (mcd) max. (mcd) n1 28.50 35.50 n2 35.50 45.00 p1 45.00 56.00 p2 56.00 71.50 q1 71.50 90.00 q2 90.00 112.50 r1 112.50 140.00 r2 140.00 180.00 s1 180.00 224.00 s2 224.00 285.00 t1 285.00 355.00 t2 355.00 450.00 u1 450.00 560.00 u2 560.00 715.00 v1 715.00 900.00 v2 900.00 1125.00 w1 1125.00 1400.00 w2 1400.00 1800.00 tolerance of each bin limit = 12% color bin select (x 7 ) individual reel will contain parts from one full bin only. x 7 0 full distribution z a and b only y b and c only w c and d only v d and e only u e and f only t f and g only s g and h only q a, b and c only p b, c and d only n c, d and e only m d, e and f only l e, f and g only k f, g and h only 1 a, b, c and d only 2 e, f, g and h only 3 b, c, d and e only 4 c, d, e and f only 5 a, b, c, d and e only 6 b, c, d, e and f only color bin limits blue min. (nm) max. (nm) a 460.0 465.0 b 465.0 470.0 c 470.0 475.0 d 475.0 480.0 cyan min. (nm) max. (nm) a 490.0 495.0 b 495.0 500.0 c 500.0 505.0 d 505.0 510.0 green min. (nm) max. (nm) a 515.0 520.0 b 520.0 525.0 c 525.0 530.0 d 530.0 535.0 packaging option (x 8 x 9 ) test package reel option current type size m1 50 ma top mount 7 inch m2 30 ma top mount 7 inch color bin limits emerald green min. (nm) max. (nm) a 552.5 555.5 b 555.5 558.5 c 558.5 561.5 d 561.5 564.5 yellow green min. (nm) max. (nm) e 564.5 567.5 f 567.5 570.5 g 570.5 573.5 h 573.5 576.5 amber/ yellow min. (nm) max. (nm) a 582.0 584.5 b 584.5 587.0 c 587.0 589.5 d 589.5 592.0 e 592.0 594.5 f 594.5 597.0 orange min. (nm) max. (nm) a 597.0 600.0 b 600.0 603.0 c 603.0 606.0 d 606.0 609.0 e 609.0 612.0 red orange min. (nm) max. (nm) a 611.0 616.0 b 616.0 620.0 red min. (nm) max. (nm) full distribution tolerance of each bin limit = 1 nm
forward voltage bin table for hsmz/v/u C a4xx-xxxxx only bin min. max. va 1.9 2.2 vb 2.2 2.5 vc 2.5 2.8 vd 2.8 3.1 ve 3.1 3.4 tolerance of each bin limit = 0.05 for product information and a complete list of distributors, please go to our website: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2010 avago technologies. all rights reserved. obsoletes av01-0312en av02-0479en - may 6, 2010 moisture sensitivity this product is qualified as moisture sensitive level 2a per jedec j-std-020. precaution when handling this moisture sensitive product is important to ensure the reliability of the product. refer to avago application note an 5305 handling of moisture sensitive surface mount devices for details. a. storage before use C unopen moisture barrier bag (mbb) can be stored at <40c/90% rh for 12 months. if the actual shelf life has exceeded 12 months and the hic indicates that baking is not required, then it is safe to reflow the leds per the original msl rating. C it is not recommended to open the mbb prior to assembly (e.g., for iqc). b. control after opening the mbb C the humidity indicator card (hic) shall be read immediately upon opening of mbb. C the leds must be kept at <30c/60% rh at all times and all high temperature related processes, including soldering, curing or rework, need to be completed within 672 hours. c. control of unfinished reel C unused leds need to be stored in sealed mbb with desiccant or in desiccator at <5% rh. d. control of assembled boards C if the pcb soldered with the leds is to be subjected to other high temperature processes, the pcb needs to be stored in sealed mbb with desiccant or in desiccator at <5% rh to ensure no leds have exceeded their floor life of 672 hours. e. baking is required if: C 10% is not blue and 5% hic indicator turns pink. C the leds are exposed to conditions of >30c/60% rh at any time. C the leds' floor life exceeds 672 hours. recommended baking conditions: 605c for 20 hours. handling precautions the encapsulation material of the ingan family product is made of silicone for better reliability of the product. as silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. these might damage the product and cause premature failure. during assembly or handling, the unit should be held on the body only. please refer to avago application note an 5288 for detail information.
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